For dicing Si wafers and  III/V- materials, Hub-type wheels are state of the art.

The matrix is always galvanic Ni, variations in diamond concentration and bond hardness. The process  performance can be influenced or optimized.


Blade thickness between 15µm und 50µm, grit size in the range of  1/3µm up to  4/6µm.

Standard exposure up to 1.3mm.

But we also are able to supply wheels with bigger exposure and bigger grit sizes for special applications.